AMAOE MI-17 CPU BGA REBALLING STENCIL FOR REDMI NOTE 12PRO / 12PRO+ - 0.12MM

AMAOE MI-17 CPU BGA REBALLING STENCIL FOR REDMI NOTE 12PRO / 12PRO+ - 0.12MM

Stencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing:- Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices:- The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design:- The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material:- Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Supported Models :-

1. MT6315GP
2. VC7920-11
3. 77048E
4. 59080
5. 58090
6. MT6190W
7. MT6359
8. MT6365
9. MT6190MV
10. RAM 556
11. MT6891Z
12. MT6893Z
13. MT6877V
14. MT6833V
15. 9902-11
16. VC7643
17. 8258-21
18. 429
19. BGA 153
20. MT6360
21. 53730-11
22. BQ25980
23. MT6635XP

Handset :-

1. NOTE 10
2. NOTE 10 PRO
3. NOTE 11
4. NOTE 11 PRO 
5. NOTE 11 PRO+
6. REDMI 11E
7. REDMI 11SE
8. REDMI 11R
9. REDDMI NOTE 12 PRO
10. REDDMI NOTE 12 PRO+
11. REDMI K40
12. POCO M3 PRO
13. POCO M4 PRO
14. POCO X3 GT

PACKAGING CONTAINTS :-

1 X AMAOE MI-17 CPU BGA REBALLING STENCIL FOR REDMI NOTE 12PRO / 12PRO+ - 0.12MM