AMAOE MI-16 CPU BGA REBALLING STENCIL FOR REDMI SERIES

AMAOE MI-16 CPU BGA REBALLING STENCIL FOR REDMI SERIES

Stencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing:- Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices:- The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design:- The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material:- Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Supported IC Models :-

1. 7708E
2. 58080-11
3. VC7643
4. MT6195W
5. BGA 153
6. MT6190MV
7. W607S13
8. W60A202
9. MT6373CW
10. MT6363AW
11. MI-6MH05
12. MT6368DW
13. MT6375P 
14. MT6319AP
15. MT6895Z RAM
16. MT6983Z
17. 78207
18. MT6637XP
19. MTK6338W
20. 53730-11
21. SC8551A

PACKAGING CONTAINTS :-

1 X AMAOE MI-16 CPU BGA REBALLING STENCIL FOR REDMI SERIES