AMAOE MI-15 CPU BGA REBALLING STENCIL FOR REDMI SERIES

AMAOE MI-15 CPU BGA REBALLING STENCIL FOR REDMI SERIES

Stencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing:- Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices:- The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design:- The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material:- Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Supported IC Models :-

1. 58080
2. SDX55M
3. WCN6856
4. WCN6851
5. BGA153
6. QCA6391
7. 77048E
8. VC7643
9. SM8450 CPU
10. SM8250 CPU
11. SM8250/8450 RAM
12. WCD9380
13. PM8350
14. PM8350C
15. SDR735
16. PM8350BH
17. PM8150A
18. P1
19. PM8450
20. QET7100
21. PMX55
22. PM8150B
23. PM8250

PACKAGING CONTAINTS :-

1 X AMAOE MI-15 CPU BGA REBALLING STENCIL FOR REDMI SERIES