MECHANIC XZ10 0.30mm Solder Ball - 10000 Pieces for BGA Rework

MECHANIC XZ10 0.30mm Solder Ball - 10000 Pieces for BGA Rework

MECHANIC XZ10 0.30mm Solder Balls, ideal for precise BGA rework and chip-level repairs. With 10,000 high-quality solder balls, ensure consistent and reliable connections in all your electronic projects. Perfect for professional technicians and DIY repair enthusiasts, these solder balls deliver superior results for BGA chip reballing and motherboard maintenance. Choose MECHANIC XZ10 for enhanced soldering precision and high-performance results in every application.

Composition:- 

Sn63/Pb37 ( 63% tin /  37% lead )

The BGA solder ball has the following characteristics: -

• Meet EU ROHS and REACH standards.
• With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
• Purity and sphericity are very high, no surface defects.
• Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
• The minimum diameter of the solder ball 0.30mm, non-standard sizes can be customized according to customer requirements.
• When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.

Package Content :-
1x Mechanic XZ10 Solder Ball - 10000 Pieces (0.30mm)