MECHANIC XG30 16g Original Solder Paste - 183℃ for PCB and BGA Repair

MECHANIC XG30 16g Original Solder Paste - 183℃ for PCB and BGA Repair

Mechanic XG30 16g Original Solder Paste, designed for PCB and BGA repair with a 183℃ melting point. Ideal for reballing and precise electronics soldering, this high-quality paste ensures reliable connections and smooth application. Perfect for professional technicians and DIY repair enthusiasts seeking superior performance in soldering projects. Choose Mechanic XG30 for consistent and efficient results.

• New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
• Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
• The viscosity is moderate, there is almost no patch collapse, and the components do not shift.
• Good wettability & Good weldability High-end quality, a unique formula, perfect performance.
• Suitable for a variety of welding environments, a wide range of applications, with high compatibility.
• The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) make the adhesion is long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
• The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance.
• Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
• Uncompromising performance in an ultra light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.

PACKAGING CONTAIN : -

1 X MECHANIC SPECIAL SOLDER PASTE XG30 16G 183℃