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MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair

MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
-37 %
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair
  • Stock: In Stock
  • Model: UV-223
  • Weight: 0.10kg
  • Dimensions: 10.00cm x 10.00cm x 5.00cm
  • SKU: PH193
190 samples sold
₹190
₹300
Ex Tax: ₹190
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MECHANIC UV-223 10CC Flux Paste - Ideal for BGA Soldering and Repair

Mechanic UV-223 10CC Flux Paste is perfect for BGA soldering and repair, offering excellent solder joint quality and reliability. This no-clean, lead-free flux ensures efficient wetting and reduced residue, making it an essential tool for precise electronics work. Ideal for professional technicians and DIY enthusiasts seeking superior soldering performance.

Product Features:-

  • Professional advanced OEM RMA-223 BGA soldering paste flux+squeeze tube +free needle tip.
  • 100% new brand and high quality.
  • Good immersion and high intensity joint.
  • Easy to peel off with hands or tweezers, leave no residue.
  • Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
  • Prevent contamination during assembly.
  • RMA-223: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
  • RMA-223 is the mixture of high-quality alloyed powder and resin pasty flux, it can avoid the pale yellow residue.
  • High soaking ,high strength joints.
  • No-toxic, no-corrosive, strong ability of insulation.
  • Good insulation and smooth welding surface.
  • No deterioration no dry.
  • No poison no corrosion, no damage to parts.

Product Specifications :-

  • Volume: 10cc
  • Dimension: 93 x 33 x 23mm
  • Material: the mixture of high-quality alloyed powder and resin pasty flux, it can avoid the pale yellow residue.
  • Colour: WHITE
  • Insulated: Yes
  • With Needle Tip: Yes
  • Application: for soldering and reballing of computer and phone chips.
  • Advantage:  Good immersion and high intensity joint.
  • Function:  for PCB , BGA , PGA rework-in.
  • 100%: New Type, high quality.

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