MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING AND FACE ID REPAIR

MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING AND FACE ID REPAIR

Multi-functional positioning pressure-reducing magic protective pad supports for iPhone X-11 lattice fixed pad 7G-8P fingerprint CPU repair, 115x97mm tin planting thermal silicone mat. Hong Hai Tong magic pad is used to repair the iPhone X-11Pro Max face dot matrix repair 7-8P fingerprint CPU.

Product Description :-

• iPhone X Face Component Groove *1
• iPhone XS Face Component Groove *1
• iPhone 11 Face Component Groove *1
• iPhone 12 Face Component Groove *1
• iPhone Dot Matrix Component Groove *1
• iPhone Infrared Front Camera Groove *1
• iPhone Fingerprint Groove* 2
• CPU Placement groove *1

Product Features :- 

1. A tool, specifically designed for repairing BGA chips of electronic products.
2. Effectively avoid tin messing caused by the deformation of steel mesh.

Packing List :-

1pc x Magic Pad