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Products meeting the search criteria
Brand: 2UUL
Model: SC98
2UUL SC98 ULTRALIGHT CARBON FIBER FPC CONNECTOR SOLDERING TIN SUCTION BAR SET WITH 3PCS NEEDLES2uul SC98 Ultralight Carbon Fiber FPC Connector Soldering Tin Suction Bar Set with 3Pcs NeedlesPackage includes:-1 x Bar3 x Needles..
₹499 ₹900
Ex Tax:₹499
Brand: 2UUL
Model: BGA MAT
2UUL Universal BGA Reballing Magnetic Platform2UUL Universal BGA Reballing Magnetic PlatformPackage Content :-1 x 2UUL Magnetic Platform2 x Blade..
₹749 ₹1,250
Ex Tax:₹749
Brand: PHONEWALEY
Model: 8018
8018 HANDHELD ADJUSTABLE TEMPERATURE HOT AIR GUN FOR IC SMD BGA DESOLDERINGFeatures:-LED digital display for easy reading while operatingCeramic heating core, increasing temperature quickly, longer service lifeNon-slip handle, comfortable to hold, and suitable for a long time operatingTemperature ca..
₹2,400 ₹3,200
Ex Tax:₹2,400
Brand: AMAOE
Model: EU-3
AMAOE EU-3 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOSAmaoe Eu-3 Cpu Bga Reballing Stencil For Samsung Exynos.Supported IC Models :-Exynos7885 RAMExynos9820Exynos9610 RAMExynos990 RAMExynos7885 CPUExynos980Exynos9610 CPUExynos990 CPUPackage Content :-1x Amaoe Eu-3 Stencils Plates...
₹149 ₹299
Ex Tax:₹149
Brand: AMAOE
Model: M53
AMAOE M53 No Clean Liquid Solder Flux - Crystal Clear for BGA WeldingAMAOE M53 No Clean Liquid Solder Flux is an advanced soldering solution designed specifically for BGA (Ball Grid Array) welding and other precision electronics applications. This crystal-clear flux features a no-clean formula, whic..
₹299 ₹400
Ex Tax:₹299
Brand: AMAOE
Model: MI-14
AMAOE MI-14 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MI-15
AMAOE MI-15 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MI-16
AMAOE MI-16 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MI-17
AMAOE MI-17 CPU BGA REBALLING STENCIL FOR REDMI NOTE 12PRO / 12PRO+ - 0.12MMStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the solderi..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MI-18
AMAOE MI-18 CPU BGA REBALLING STENCIL FOR POCO C40 - 0.12MMStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reball..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MI-19
AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MMStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the sol..
₹180 ₹250
Ex Tax:₹180
Brand: AMAOE
Model: MQ-1
AMAOE MQ-1 STENCIL FOR MTK / QUALCOMM CPUStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:- Stencils are..
₹149 ₹250
Ex Tax:₹149