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Products meeting the search criteria
-250x250.jpg "2UUL 4-in-1 Precision Blade Set for Motherboard & BGA IC Glue Cleaning")
-39 %
Brand: 2UUL
Model: DA-11
2UUL 4-in-1 Precision Blade Set for Motherboard & BGA IC Glue Cleaning2UUL 4 In 1 SEXY Blades Hand Finish For Phone PCB Under-fill Clean Multi-functional Motherboard BGA Chip Glue Cleaning Scraping Pry KnifeA special process handle, sandblasting can produce a shine in the alloy surface and fine ..
₹550 ₹900
Ex Tax:₹550
-250x250.jpg "2UUL Non-Slip Blade Handle - Precision Tool for PCB & BGA IC Glue Cleaning")
-42 %
Brand: 2UUL
Model: HANDLE
2UUL Non-Slip Blade Handle - Precision Tool for PCB & BGA IC Glue CleaningPackaging Contains :-1 x Handle..
₹320 ₹550
Ex Tax:₹320
-250x250.jpg "2UUL Universal BGA Reballing Magnetic Platform")
-40 %
Brand: 2UUL
Model: BGA MAT
2UUL Universal BGA Reballing Magnetic Platform2UUL Universal BGA Reballing Magnetic PlatformPackage Content :-1 x 2UUL Magnetic Platform2 x Blade..
₹749 ₹1,250
Ex Tax:₹749
-250x250.jpg "8018 HANDHELD ADJUSTABLE TEMPERATURE HOT AIR GUN FOR IC SMD BGA DESOLDERING")
-250x250.jpg "8018 HANDHELD ADJUSTABLE TEMPERATURE HOT AIR GUN FOR IC SMD BGA DESOLDERING")
-25 %
Brand: PHONEWALEY
Model: 8018
8018 HANDHELD ADJUSTABLE TEMPERATURE HOT AIR GUN FOR IC SMD BGA DESOLDERINGFeatures:-LED digital display for easy reading while operatingCeramic heating core, increasing temperature quickly, longer service lifeNon-slip handle, comfortable to hold, and suitable for a long time operatingTemperature ca..
₹2,400 ₹3,200
Ex Tax:₹2,400
-250x250.jpg "AMAOE EMMC-2 STENCIL FOR EMMC / EMMCP / UFS")
-40 %
Brand: AMAOE
Model: EMMC-2
AMAOE EMMC-2 STENCIL FOR EMMC / EMMCP / UFSStencil Purpose:- Stencils are used to precisely apply solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:- Stencils are also comm..
₹149 ₹250
Ex Tax:₹149
-250x250.jpg "AMAOE EU-3 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS")
-50 %
Brand: AMAOE
Model: EU-3
AMAOE EU-3 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOSAmaoe Eu-3 Cpu Bga Reballing Stencil For Samsung Exynos.Supported IC Models :-Exynos7885 RAMExynos9820Exynos9610 RAMExynos990 RAMExynos7885 CPUExynos980Exynos9610 CPUExynos990 CPUPackage Content :-1x Amaoe Eu-3 Stencils Plates...
₹149 ₹299
Ex Tax:₹149
-250x250.jpg "AMAOE M10 50G SOLDERING PPD PASTE 183 TEMPERATURES FOR BGA REPAIR")
-42 %
Brand: AMAOE
Model: M10
AMAOE M10 50G SOLDERING PPD PASTE 183 TEMPERATURES FOR BGA REPAIRAlloy Composition :- 63% Tin (Sn), 37% Lead (Pb)Melting Point :- 183°C (361.4°F)Flux Type :- Rosin-basedWire Diameter :- Typically around 0.8mm (check specific packaging for exact diameter)Application :- Suitab..
₹290 ₹500
Ex Tax:₹290
-250x250.jpg "AMAOE M53 No Clean Liquid Solder Flux - Crystal Clear for BGA Welding")
-25 %
Brand: AMAOE
Model: M53
AMAOE M53 No Clean Liquid Solder Flux - Crystal Clear for BGA WeldingAMAOE M53 No Clean Liquid Solder Flux is an advanced soldering solution designed specifically for BGA (Ball Grid Array) welding and other precision electronics applications. This crystal-clear flux features a no-clean formula, whic..
₹299 ₹400
Ex Tax:₹299
New
-28 %
Brand: AMAOE
Model: MI-14
AMAOE MI-14 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
New
-28 %
Brand: AMAOE
Model: MI-15
AMAOE MI-15 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
New
-28 %
Brand: AMAOE
Model: MI-16
AMAOE MI-16 CPU BGA REBALLING STENCIL FOR REDMI SERIESStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.Reballing:-..
₹180 ₹250
Ex Tax:₹180
New
-28 %
Brand: AMAOE
Model: MI-17
AMAOE MI-17 CPU BGA REBALLING STENCIL FOR REDMI NOTE 12PRO / 12PRO+ - 0.12MMStencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the solderi..
₹180 ₹250
Ex Tax:₹180