AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM

AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM

Stencil Purpose:- Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing:- Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices:- The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design:- The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material:- Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Model Numbers Supported :-

1. 58080
2. 77048E
3. PM8550VE
4. WCN7851
5. PM8550BH
6. SDR735
7. VC7643
8. SM8550
9. BGA153
10. RAM496
11. 27999
12. 8550VS
13. QDM4303
14. P1
15. JE218
16. QET7100

PACKAGING CONTAINTS :-

1 X AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM